Semishare

        – 1.    DC:
a.    Manual: 50mm – 100mm – 150mm – 200mm – 300mm
b.    Semi – auto: 50mm – 100mm – 150mm – 200mm – 300mm
c.    Full – auto: 50mm – 100mm – 150mm – 200mm – 300mm
d.      X – Y – Z moving range 300mm – resolution 0,1um – Position accuracy better then 2um – speed >300mm/s – Theta axis resolution 0.0001”

– 2.    CRYOGENIC:  4K-500K resolution 0.001K  – Stability 50mK – High vacuum better then 1×10^-6Pa – Current leakage 300mm/s – Theta axis resolution 0.0001”

 – 3.    RF (up to THz):
a.    Manual:  50mm – 100mm – 150mm – 200mm – 300mm
b.    Semi – auto: 50mm – 100mm – 150mm – 200mm – 300mm
c.    Full – auto: 50mm – 100mm – 150mm – 200mm – 300mm
X – Y – Z moving range 300mm – resolution 0,1um – Position accuracy better then 2um – speed >300mm/s – Theta axis resolution 0.0001”

    – 4.    Hi-Power up to  10kV
a.    Manual: 50mm – 100mm – 150mm – 200mm – 300mm
b.    Semi – auto: 50mm – 100mm – 150mm – 200mm – 300mm
c.    Full – auto: 50mm – 100mm – 150mm – 200mm – 300mm
X – Y – Z moving range 300mm – resolution 0,1um – Position accuracy better then 2um – speed >300mm/s – Theta axis resolution 0.0001”

To prevent Hi-Voltage arcing, Semishare uses Vacuum up to 10kV and air pressure solution under 10kV, avoiding Fluorinert liquid that  make wafer dirty.

 – 5.    Double side probe station

Thin wafer handling capability using multi hole vacuum chuck for a better flatness

On each Probe station we can offer:

• Temp Characterization with:

ERS Air cooling Thermal Chuck (from Germany): Available upper temperature limits     +150, +175, +200, +220, +300, +350, +400 °C
Available lower temperature limits     +35, +20, 0, -20, -40, -55, -60 (300 mm), -65 (150 mm, 200 mm) °C
Coolant     Air (user supplied)
Chuck temperature display resolution     0.01°C
Smallest temperature selection step     0.1°C
Temperature stability / accuracy     ±0.08 °C / ±0.1 °C

Semishare Thermal chuck for high Temp. up to 600deg.C

• Wafer thickness auto measurement: probe tip height auto detect.
• Multiband Laser cut and Laser mark option: New-Waves sophisticated and reliable advanced laser transmission system ABDS allows different wave bands to be selected for different material cutting and cutting jobs
• EMMI Integration
• InGaS chamber integration
• VNA integration
  
• Parameter Analyzer integration
  
• Shielding Chamber
• Dark Box
• Antivibration table