Descrizione
High precision soft and hard baking
The Hotplate HP-300 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. It can be used for substrates with a diameter of up to 300 mm and thickness of 14 mm at maximum (proximity/loading pins in the upper start position). The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.
The high-precision instruments are available as mobile cabinet and bench-mounted unit.









